Wafer-Gripper (24B1.12)-C8-AA07

Dry adhesive microstructure for high-speed wafer-handling

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Important note

This dry-adhesive microstructure is specifically engineered for applications in which the wafer is positioned on top of the adhesive surface.
To achieve best results, a minimum of three pads is required.

(*) Data measured with a 200 g polished, cleaned, wafer placed on three pads at the time of production.

Data sheet

Working temperature: 0 - 50 °C
Residue-free: An independent study at the Environmental Campus Birkenfeld has confirmed that INNOCISE adhesion grippers leave no residues on wafers.
Carrier dimensions: No carrier
Wafer weight: Up to 200 g
Ø Gripping surface: 8 mm
Gripper material: PU
Shear-Adhesion: 4,2 – 5 N/cm² (*)
Acceleration (horizontal): Up to 40 m/s² (*)
Normal-Adhesion: 1,3 – 2,2 N/cm² (*)
Placement-Vibration: < 0,3 G measured at 60 mm/s impact speed with 200 g Si-Wafer
Placement-Accuracy: Up to 20 µm (*)
UV resistance: Good, service life may be affected by strong exposure to radiation
Storing temperature: 15 - 25 °C
Cleaning methods: Cleaning with residue-free adhesive tape (**)
Cleaning interval: Process dependent
Pad thickness: 1,00 mm ± 100 µm
Cleanroom class: ISO 1 as per ISO 14644 and measured with Lighthouse Solair 3100