Warped Wafer Gripper 24B1.EW10-C8/C14/H3,3.
Snap in Gripper with dry adhesive microstructure for high-speed warped wafer-handling
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Measurement Conditions
- Data measured with a 126 g polished and cleaned wafer placed on three wafer pads at the time of production.
- Measurements performed using 3 wafer pads.
- Preload: 0.4 N (approximately 1/3 of the wafer weight).
- Additional sensor weight: 20 g.
Cleaning
- Product number: 1000553
- Cleaning method: Residue-free adhesive tape – Strong
Independent Verification
An independent study conducted by the Environmental Campus Birkenfeld confirmed that INNOCISE adhesion grippers leave no residues on wafers.
Disclaimer
The values stated were measured under the specified test conditions using a polished and cleaned wafer. Actual performance may vary depending on wafer surface condition, cleanliness, environmental factors, and application parameters.
Data sheet
- Working temperature
- 𝗨𝗽 𝘁𝗼 150 °𝗖
- Residue-free
- Confirmed (5)
- Carrier dimensions
- See drawing images
- Wafer weight
- 𝗨𝗽 𝘁𝗼 200𝗴
- Ø Gripping surface
- 8 𝗺𝗺
- Dimension over fork
- 1,00 𝗺𝗺 ± 100 𝝻𝗺
- Gripper material
- PU
- Shear-Adhesion
- < 4 𝗡/𝗰𝗺² (1)
- Acceleration (horizontal)
- 𝗨𝗽 𝘁𝗼 18,5 𝗺/𝘀² (1)
- Normal-Adhesion
- 0,5 𝗡/𝗰𝗺² (2)
- Placement-Vibration
- < 0,3 𝗚 𝗺𝗲𝗮𝘀𝘂𝗿𝗲𝗱 𝗮𝘁 60 𝗺𝗺/𝘀 𝗶𝗺𝗽𝗮𝗰𝘁 𝘀𝗽𝗲𝗲𝗱 (1)(3)
- Placement-Accuracy
- 20 𝝻𝗺 (1)(3)
- UV resistance
- Good
- Storing temperature
- 15 - 25 °𝗖
- Cleanroom
- Clean room ready
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Snap in Gripper with dry adhesive microstructure for high-speed warped wafer-handling
€ Price hidden — Please create a free account to view or buy this product.