Wafer-Gripper (24B1.12)-C8-AA07

Dry adhesive microstructure for high-speed wafer-handling

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Important note

This dry-adhesive microstructure is specifically engineered for applications in which the wafer is positioned on top of the adhesive surface.
To achieve best results, a minimum of three pads is required.

Measurement Conditions

(*) Data measured with a 200 g polished, cleaned, wafer placed on three pads at the time of production.

Cleaning

(**) Product numbers: 1000553
Cleaning method: Residue-free adhesive tape - Strong

Data sheet

Working temperature: 0 - 50 °C
Residue-free: 𝗔𝗻 𝗶𝗻𝗱𝗲𝗽𝗲𝗻𝗱𝗲𝗻𝘁 𝘀𝘁𝘂𝗱𝘆 𝗮𝘁 𝘁𝗵𝗲 𝗘𝗻𝘃𝗶𝗿𝗼𝗻𝗺𝗲𝗻𝘁𝗮𝗹 𝗖𝗮𝗺𝗽𝘂𝘀 𝗕𝗶𝗿𝗸𝗲𝗻𝗳𝗲𝒍𝗱 𝗵𝗮𝘀 𝗰𝗼𝗻𝗳𝗶𝗿𝗺𝗲𝗱 𝘁𝗵𝗮𝘁 𝗜𝗡𝗡𝗢𝗖𝗜𝗦𝗘 𝗮𝗱𝗵𝗲𝘀𝗶𝗼𝗻 𝗴𝗿𝗶𝗽𝗽𝗲𝗿𝘀 𝗹𝗲𝗮𝘃𝗲 𝗻𝗼 𝗿𝗲𝘀𝗶𝗱𝘂𝗲𝘀 𝗼𝗻 𝘄𝗮𝗳𝗲𝗿𝘀.
Carrier dimensions: No carrier
Wafer weight: 𝗨𝗽 𝘁𝗼 200𝗴
Ø Gripping surface: 8 𝗺𝗺
Gripper material: PU
Shear-Adhesion: 4,2 – 5 𝗡/𝗰𝗺² (*)
Acceleration (horizontal): 𝗨𝗽 𝘁𝗼 40 𝗺/𝘀² (*)
Normal-Adhesion: 1,3 – 2,2 𝗡/𝗰𝗺² (*)
Placement-Vibration: < 0,3 𝗚 𝗺𝗲𝗮𝘀𝘂𝗿𝗲𝗱 𝗮𝘁 60 𝗺𝗺/𝘀 𝗶𝗺𝗽𝗮𝗰𝘁 𝘀𝗽𝗲𝗲𝗱 𝘄𝗶𝘁𝗵 200 𝗴 𝗦𝗶-𝗪𝗮𝗳𝗲𝗿
Placement-Accuracy: 𝗨𝗽 𝘁𝗼 20 𝝻𝗺 (*)
UV resistance: 𝗚𝗼𝗼𝗱, 𝘀𝗲𝗿𝘃𝗶𝗰𝗲 𝗹𝗶𝗳𝗲 𝗺𝗮𝘆 𝗯𝗲 𝗮𝗳𝗳𝗲𝗰𝘁𝗲𝗱 𝗯𝘆 𝘀𝘁𝗿𝗼𝗻𝗴 𝗲𝘅𝗽𝗼𝘀𝘂𝗿𝗲 𝘁𝗼 𝗿𝗮𝗱𝗶𝗮𝘁𝗶𝗼𝗻
Storing temperature: 15 - 25 °𝗖
Cleaning methods: 𝗖𝗹𝗲𝗮𝗻𝗶𝗻𝗴 𝘄𝗶𝘁𝗵 𝗿𝗲𝘀𝗶𝗱𝘂𝗲-𝗳𝗿𝗲𝗲 𝗮𝗱𝗵𝗲𝘀𝗶𝘃𝗲 𝘁𝗮𝗽𝗲 (**)
Cleaning interval: 𝗣𝗿𝗼𝗰𝗲𝘀𝘀 𝗱𝗲𝗽𝗲𝗻𝗱𝗲𝗻𝘁
Pad thickness: 1,00 𝗺𝗺 ± 100 𝝻𝗺
Cleanroom class: 𝗜𝗦𝗢 1 𝗮𝘀 𝗽𝗲𝗿 𝗜𝗦𝗢 14644 𝗮𝗻𝗱 𝗺𝗲𝗮𝘀𝘂𝗿𝗲𝗱 𝘄𝗶𝘁𝗵 𝗟𝗶𝗴𝗵𝘁𝗵𝗼𝘂𝘀𝗲 𝗦𝗼𝗹𝗮𝗶𝗿 3100